Damaged leads are one of the main reasons for failures in electronics manufacturing. For this reason, Source Electronics uses automated lead scanning systems to verify lead tolerances meet specifications. Lead scanning is proven to reduce PPM levels and increase product yields. 3-D vision inspection measures coplanarity, pitch, offset and other standards.

Package Types:

• QFP
• BGA
• SOIC
• TSOP

Lead Tests:

Coplanarity	Body Standoff
Pitch	Offset
Skew	Half Span
Length Deviation	Width
Terminal Dimensions	Foot Angle

BGA Tests:

Presence	Offset
Pitch	Width
Quality

Lead Scanning Technical Data Sheet [pdf file]

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